UWP300 Fully Automatic Probe Station

产品详情

UWP300 Fully Automatic Probe Station

Equipment Type		UWP300
Wafer Specifications	Wafer Diameter‌	200 mm / 300 mm
	‌Thickness (T)‌	200μm~2200 μm
	Weight‌	≤500g
	Die Size	300 μm-100000 μm
XY Axis Specifications‌	Travel	X:±170mm;Y:-180,+600 mm
	Accuracy‌	≤±1μm
	Resolution	0.1μm
	Maximum Speed‌	240 mm/s
‌Z Axis Specifications	Accuracy‌	≤±1μm
	Resolution	0.1μm
	Maximum Speed‌	80mm/s
Theta Specifications	Range	±10°
Theta Specifications	Accuracy‌	0.00001°
Cassette /Wafer Size		φ200mmD300mm
Dimensions (L×W×H) in mm		*160016601450*
Weight (kg)‌		2000
Power Requirement		50/60 HzAC220V
CDA Pressure		0.4-0.8 Mpa
Vacuum Pressure		53-100 Kpa

Overview

Key Features

The UWP300 Fully Automatic Probe Station delivers a fully automated wafer-level probing solution, designed as a dual-size compatible test system for both 200 mm and 300 mm standard wafers, supporting ‌Wafer Acceptance Test (WAT)‌ and ‌Chip Probing (CP)‌ applications.

The upgraded UWP301 model introduces significant technological enhancements across key performance domains:

‌Automatic Wafer Loading/Unloading and Transport‌
‌Micron-Level Fully Closed-Loop Motion Control‌
‌Automatic Wafer-to-Probe Alignment‌
‌Vision-Based Automatic Calibration‌
‌High-Speed Feedback Communication‌
‌Advanced Data Processing Capability‌
These improvements enable the system to deliver a ‌cost-effective, efficient, and stable testing solution‌ tailored to diverse customer requirements across high-volume semiconductor manufacturing environments.

Automatic Wafer Loading/Unloading and Transport‌
Micron-Level Fully Closed-Loop Motion Control‌

High-Strength, Low-Center-of-Gravity Mechanical

Design‌ High Precision and Throughput for Enhanced Test Efficiency‌

7×24 In-Situ Probe Capability‌
Intuitive Human-Machine Interface (HMI)‌

Frist-degree Menu

Frist-degree Menu

UWP300 Fully Automatic Probe Station