2D MEMS Probe Card For MEMS

2D MEMS Probe Card For MEMS

Micro-needle Semiconductor – Technical Capability‌

• Capable of manufacturing micron-level blade probes on silicon wafer substrates.

• Utilizes automated laser welding equipment to directly weld tens of thousands of MEMS probes onto MLC (ceramic substrate).

Specifications ‌

• Automated needle insertion equipment, up to 7,000 pins/card

• Decoupling capacitors mounted closest to the device under test, minimizing loop inductance and enhancing contact performance

• MEMS probes directly laser-welded onto MLC surface, ensuring superior signal integrity

• Full Channel Isolation

• Minimal scratches, with 80% reduction in particulate contamination compared to traditional cantilever probe cards

• Excellent electrical test performance: low contact impedance and ultra-low leakage current

• High alignment accuracy

• Customizable CCC and Pin Force capabilities

 Nand Flash / DRAM Specialized MEMS Probe Card

• MEMS probes fabricated using micro-electromechanical systems (MEMS) technology

• Up to 70,000 pins directly laser-welded onto MLC/MLO via fully automated laser welding

• Designed for Nand Flash / DRAM One Touch test applications

Features

• Optimal choice for One Touch testing, up to 70,000 pins

• Full Channel Isolation

• Minimal scratches, low particulate contamination

• Excellent electrical performance: low contact impedance and ultra-low leakage current

• High alignment accuracy