Wafer Inspection and Sorting Machine

产品详情

Wafer Inspection and Sorting Machine

Wafer Inspection and Sorting Machine.jpg

Specification Parameters

‌AOI Configuration‌	Front-side AOI, Back-side AOI, Four-Side AOI
‌Detected & Sorted Product Edge Length‌	0.5 mm ~ 15.5 mm
‌Alignment Accuracy‌	X, Y ±25 μm; Angular Tolerance < ±1°
‌Continuous Sorting Cycle Time (CT)‌	Fastest 200 ms (for 3 mm × 3 mm die)
‌Wafer Ring & Bin Ring Compatibility‌	Supports 8-inch and 12-inch Disco metal rings
‌Carrier Configuration‌	1 Bin Box Slot + 1 Wafer Box Slot
‌Cleanroom Class‌	Class 100
‌Defect Detection Items‌	Crack, Scratch, Chipping, Edge Residue, Dimensional Deviation, Feature Shift
‌Multi-Bin Operation Features‌	Barcode Matching, MAP Row/Column Control, Sorting Traceability
‌Map-Free Sorting Capabilities‌	Die Pattern Recognition, Cutting Mark Recognition and Correction
‌Placement Shape MAP Import & TXT Generation‌	Supports import of placement shape MAP files and automatic generation of TXT output files

Overview

The equipment is an automated die sorting and AOI inspection system designed for transferring individual die from blue film to blue film.

During the sorting process, automated optical inspection (AOI) is performed on all surfaces of each die.

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