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Multi Die Bonder
Specification Parameters
| Device Performance Specifications | Evo | Evo Advanced |
| XY Accuracy: | ±10 um@3Sigma | ±3 um@3Sigma |
| Angular Accuracy: | ±0.5° | ±0.07° |
| UPH (Units Per Hour): | IPT: 600 | Uplook: 2000 | IPT: 400 |
| Dispensing Function: | Dotting, Drawing, Dipping, Flux Adhesion; Optional Sys1 or Sys2 dispensing modules | |
| Height Measurement: | Standard: Contact probe height measurement module Optional: Non-contact laser height measurement module | |
Overview
High-Precision, Multi-Die, Complex Process Die Bonding System
Designed for high-precision, multi-die, complex-process die bonding
Supports: Drawing, Dipping, Flux Adhesion, Die Bonding, Eutectic Bonding, Flip-Chip
Widely applied in: Memory, Industrial Lasers, Optical Communications, LiDAR, CIS, MEMS, IGBT
