Wafer Dicing Saw

产品详情

Wafer Dicing Saw

Wafer Dicing Saw晶圆切割机(划片机).jpg

Specification Parameters

Item		Data
Maximum size of workpiece		φ300mm
X axis	Dicing range	310mm
X axis	Feed speed input range	0.1-1000mm/s
Y1.Y2 axis	Dicing range	310mm
	Single step	0.0001mm
	Y axis positional accuracy	Within 0.003mm/310mm
Z1.Z2 axis	Maximum valid stroke	14.7mm(with φ2 blade)
	Movement resolution	0.00005mm
	Repeat accuracy	0.001mm
	Maximum blade diameter	φ58mm
θ axis	Maximum rotation angle	380°
Spindle	Operating speed range(rpm)	10000-60000
	Maximum power(KW)	1.8/2.4 at 60000rpm
	Torque(N.M)	0.3/0.4(15000-60000rpm)
Broken Blade Online Detection		Yes
Blade presetting with Non-Contact Sensor		Yes
Automatic sharpening		Yes
GEM communication protocol		Yes
Maximum frame size		8-12 inches
Other specifications	Power	Three-phase AC380V
	Equipment size	158012601750mm(LWH)
	Equipment weight	=1500KG

Wafer Dicing Saw晶圆切割机-1.jpg

Fully Automated Dual-Axis Dicing Saw suitable for dicing of Si wafers, SiC wafers, ceramic substrates, glass substrates, optical glass, and magnetic materials. It also compatible with 8" and 12" wafers

Key Performance Comparison

Index	Disco	KINGWISE	Remark
Qty of spindles	2	2	/
‌Spindle Output Power (kW)	1.8	1,882.4	Maximum power up to 2.4 kW; supports Si, SiC, and compound semiconductor wafers — multi-material capability
X-axis Feed Rate Range (mm/s)	0.1～1000	0.1～1000	/
Y-axis Step Increment (mm)‌	0.0001	0.0001	/
Y-axis Positioning Accuracy (mm)‌	0.003	0.003	/
Z-axis Motion Resolution (mm)‌	0.00005	0.00005	/
Z-axis Repeatability (mm)	0.001	0.001	/
Blade Breakage Detection	Yes	Yes	/
Non-contact Height Measurement‌	Yes	Yes	/
Automatic Blade Sharpening	Yes	Yes	/
‌Cutting Accuracy (μm)	≤3	≤3	/
Minimum Kerf Width (μm)	35	35	/
Minimum Die Size (mm)	/	0.2*0.2	/
Minimum Cut Thickness (μm)‌	50	50	/
Equipment Service Life (years)‌	10	10	/
Delivery Lead Time (months)	6	3	Advantage
Customization Support	No	Yes	Advantage

Frist-degree Menu

Frist-degree Menu

Wafer Dicing Saw