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Jiangsu Changjiang Electronics Technology Co., Ltd. (Changdian Technology) Announces Large-Scale Capacity Expansion, Plans to Invest RMB 7.8 Billion to Build Advanced Packaging and Testing Plant
Jun 25, 2026
On June 24, Changdian Technology (Stock Code: 600584) closed at the daily limit, reaching a price of 94.7 RMB per share, an increase of 10%. This marks the second daily limit within the recent three trading days.
In an evening announcement on June 24, Changdian Technology stated that to accelerate its strategic deployment in high-end advanced packaging capacity, the company plans to establish a controlling subsidiary to invest in and construct a high-end advanced packaging and testing factory at the Wanxiang Industrial Park within Shanghai Lingang's "Oriental Silicon Port." The total project investment is estimated at RMB 7.8 billion (final investment amount subject to actual project expenditures), with an estimated registered capital of RMB 4.0 billion for the newly established subsidiary.
The project will be developed in two phases:
Phase I: Includes plant construction, interior fit-out, and equipment investment, scheduled for completion in the second half of 2028.
Phase II: Primarily focuses on equipment investment for capacity expansion, to be dynamically adjusted based on technological progress, market conditions, and Phase I results.
Changdian Technology emphasized that this investment aligns with the company's strategic planning and business development needs. It will enhance the industrial layout, accelerate the deployment of high-end advanced packaging capacity, and strengthen overall competitiveness.
The company possesses advanced and comprehensive chip manufacturing technologies, including Wafer-Level Packaging (WLP), 2.5D/3D Packaging, System-in-Package (SiP), Flip-Chip Packaging, Wire Bonding Packaging, and advanced solutions for mainstream packaging. These technologies are widely applied in automotive electronics, artificial intelligence, high-performance computing, high-density storage, network communications, smart terminals, industrial and medical equipment, power, and energy sectors.
Changdian operates eight production bases across China, South Korea, and Singapore, supported by over 20 business offices worldwide, providing close technical collaboration and efficient supply chain support.
Previously, during the 2025 Annual and Q1 2026 Earnings and Cash Dividend Briefing, the company indicated a capital expenditure budget of approximately RMB 10.0 billion for 2026, a significant increase from the previous year. This demonstrates Changdian's commitment to strategically capturing opportunities in the semiconductor industry, with investment scale and level ranking among the highest in the domestic packaging and testing sector.
Beyond sustaining routine capital expenditures, investments will focus on two key areas:
Increasing R&D investment to accelerate the commercialization of technological achievements.
Capacity expansion, prioritizing advanced packaging production lines while expanding mainstream packaging capacity based on customer demand.
Applications are concentrated in strategic domains such as computing and automotive electronics, continuously optimizing business and product portfolios.
According to the company, the new capacity is centered on AI-driven industry demands, specifically addressing requirements in computing power, storage power, and power electronics for advanced packaging. Changdian’s advanced packaging portfolio includes market-highlighted 2.5D and 3D wafer-level packaging, as well as high-density 3D SiP centered on heterogeneous integration.
Regarding capacity ramp-up, the company is firmly advancing 2.5D capacity construction while simultaneously developing 3D technologies and related capacity planning. High-level investments in automotive electronics continue, with ramp-up progress meeting expectations.
The company acknowledges the balance between short-term utilization and long-term demand, reflecting the strategic resilience of a large-scale, financially robust integrated enterprise. Currently, Changdian is steadily improving profitability and margins through existing business recovery. Even if some short-term profits must be moderately sacrificed and non-advanced capacity adjusted, the company remains resolute in creating space and increasing investments in computing power, storage power, and power electronics.
Changdian stated that it currently maintains ample funding and smooth financing channels, with strong support from major shareholders. While ensuring financial health, the company will pursue high-intensity R&D and capacity investments, making strategic business trade-offs. It is prepared to withstand short-term profit pressure and transitional adjustments, firmly focusing on advanced packaging and driving the advancement of mainstream packaging.
By balancing these factors, Changdian aims to accelerate customer adoption and volume expansion, shortening the cycle for technological commercialization.
Source: Securities Times
Author: Sun Xianchao
