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English
Jun 22, 2026
To meet the expanding packaging demands driven by AI GPU and high-performance computing (HPC) chips, TSMC is accelerating the implementation of its CoPoS (Chip-on-Panel-on-Substrate) technology. Departing from traditional round wafer carriers, the new approach utilizes large rectangular glass panels for packaging manufacturing. The first wave of demonstration equipment has now been installed at TSMC's subsidiary, VisEra, marking the full launch of production line verification.
CoPoS Technology Roadmap Fully Launched, Trademark and Production Lines Advance Simultaneously
TSMC Chairman C.C. Wei first disclosed the CoPoS technology plan during the April 2026 earnings conference. Recent filings with the Taiwan Intellectual Property Office show that TSMC has completed the trademark application for "TSMC-COPOS", signaling the official rollout of this technology roadmap. Prior to this, TSMC had finalized the initial equipment supply chain assessment list, with global equipment manufacturers synchronizing their R&D efforts to meet TSMC's stringent qualification standards.
Supply chain sources indicate that the complete CoPoS production line covers the entire process flow: glass substrate pretreatment, photoresist coating, exposure, copper plating, grinding, high-precision die attach, molding, optical metrology and inspection, and final sorting. International equipment giants and local Taiwanese suppliers are simultaneously competing for positions, entering the equipment sampling and verification phase. Once certified by TSMC, they are poised to benefit significantly from subsequent order surges driven by CoPoS equipment volume expansion.
VisEra's Longtan plant has initiated the industry's first CoPoS pilot production line, with equipment gradually arriving for integrated verification. The supply chain reveals that most equipment on this production line continues from the existing CoWoS supplier ecosystem. However, due to the significantly increased process complexity of CoPoS, many suppliers' verification progress has fallen behind expectations. Lam Research successfully secured demo equipment orders for the pilot line, outperforming American competitors, while Powertech Technology and Scientech are leading their peers in certification progress.
CoPoS Equipment Certification Cycle is Lengthy, Industry Competition Intensifies
According to industry manufacturers, the certification threshold for CoPoS equipment is substantially higher than for traditional packaging equipment. The entire verification process follows a standardized procedure: equipment suppliers first submit complete technical documentation and process experimental data. After TSMC evaluates the feasibility of the proposal, it provides its own chip samples to the equipment manufacturer for on-site testing. Demo verification equipment is typically provided free of charge by the supplier for customer testing, with the manufacturer bearing the R&D and manufacturing costs. A single cycle from equipment delivery to completed demo integrated verification takes approximately 3 months, while the customer's full process verification and mass production qualification certification period is even longer. The overall timeline from initial testing to securing formal purchase qualification can extend up to 1.5 years.
Currently, the vast majority of CoPoS equipment suppliers in the market possess only 1–2 demo units, indicating a considerable period remains before large-scale volume supply. Even if demo equipment passes testing, it does not guarantee locked-in volume orders. Factors such as failing to meet technical specifications, excessively high equipment costs, or adjustments to the customer's production line planning can eliminate suppliers, making competition in this segment fierce. However, successfully completing demo integration and entering the formal mass production certification pipeline significantly increases the probability of ultimately securing stable orders.
CoPoS equipment consists of customized special-configuration models, with unit prices higher than existing wafer-level packaging equipment platforms. As equipment is currently in the concentrated certification phase, final transaction prices will be negotiated separately based on customer volume requirements. Supply chain institutions predict the CoPoS mass production timeline: industry conservative estimates point to batch equipment installation in 2028 and full-scale volume expansion by 2030. However, with TSMC continuously accelerating technology iteration, if R&D verification proceeds smoothly, breakthroughs in scaled mass production could be achieved as early as 2029.
CoPoS Production Line Reconstructs the Entire Packaging System, Driving Comprehensive Equipment Upgrade
The industry clarifies that CoPoS is not simply a scaled-up version of the existing CoWoS process. It represents a reconstruction of a new advanced packaging production line centered on square glass panels, covering six core segments:
Glass substrate processing
Panel-level large-size RDL (Redistribution Layer)
Ultra-large panel exposure
Micron-level high-precision die attach
Full-process ultra-low warpage control
A new supporting metrology and inspection systems
Equipment selection, process parameters, and hardware standards fundamentally differ from the original CoWoS production line.
Comprehensive Layout of Equipment Suppliers by Category
Exposure, Coating, and Development Equipment
Canon's FPA-5525iV LF2 exposure tool, Germany's SUSS DSC310s Gen4 exposure equipment paired with the ACS310 Gen2 integrated coating/development platform, Japan's TEL LITHIUS Pro SQ3, SCREEN's LM-3000 coater, and Scientech's panel debonding layer专用涂布设备 are all included in the supply chain list.Metallization and Copper Plating/Etching Equipment
Due to CoPoS requirements for ultra-large panel RDL wiring and micron-level fine-line processes, metallization equipment specifications have been upgraded accordingly. Applied Materials, KLA-Tencor, and Lead Precision have entered the metrology/metallization equipment list. The copper plating process is handled by Lam Research's SABRE 3D FP equipment, while the UBM etching equipment selected is Lam Research's Quaros FP series.Grinding, Laser Processing, and Film Material Supporting Equipment
Japan's DISCO secures core orders for grinding and laser processing equipment. Nitto supplies Frame Mount carrier films and UV debonding equipment. LINTEC is responsible for the full-process equipment and tool for film lamination and delamination. Die attach equipment follows two main routes: KNS's APTURA WP fluid-free die bonder and ASMPT's Firebird XQ high-precision die bonder are being introduced simultaneously. Japan's Shibaura Machine has launched the TFC-6600-WB and TFC-6500-WB bonding systems. Wanrun supplies panel underfill equipment.Wet Process and Baking/Thermal Processing Equipment
Hongsu and Scientech are the core Taiwanese suppliers for wet processes. Inno's BPO-60A, KE 450A/450A-HT high-temperature wet process equipment, and Chinsan's HOMOL-AP31, HP-AP31, CSL-A300PL panel baking/thermal processing equipment are being mass production.Molding and Reflow Equipment
Molding equipment is supplied by Japan's TOWA and YAMada. Reflow ovens selected are from the SEMIGEAR and Heller series.Dedicated Metrology and Inspection Equipment for Glass Substrates
With the extensive use of glass substrates, the importance of inline inspection and dimensional metrology has significantly increased. Taiwanese manufacturers have achieved key breakthroughs in this segment:
Powertech Technology has become a core supplier in this supply chain, with its V5P310 Pro Glass dedicated glass AXI inspection equipment and V5300 Macro AOI appearance inspection system同步进场 (simultaneously entering the site).
Jingcai Technology is responsible for Overlay overlay metrology.
Vigor Semiconductor provides 3D profile and dimensional metrology equipment.
Dahliang Technology, in collaboration with Japan's KOBELCO, has introduced edge detection and bonding offset metrology equipment.
Other Taiwanese companies simultaneously included in the supply chain comprise Chroma, Gudeng, JungHua, Jiachen, Hehua, and others.
Industry Landscape Reshaped, Local Equipment Manufacturers Seize New Opportunities
Industry analysis indicates that the entirely new CoPoS technology track creates a fresh window for Taiwanese local equipment enterprises to secure positions. The全新的技术门槛 (entirely new technical barriers) in glass substrate processing, panel-level large-size exposure, ultra-large panel uniform copper plating, full-process low-warpage control, and high-precision inline inspection provide many equipment manufacturers previously unable to enter the CoWoS supply chain an opportunity to compete on the same stage. The overall technological iteration in advanced packaging is also accelerating the transformation of companies like Santais, Huayang Precision Machinery, and Yuecheng, opening up new growth space.
It is noteworthy that Mainland China's glass substrate equipment suppliers have not yet entered TSMC's evaluation list.
Source: King-W Industry News
