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Q: What are the considerations for probe replacement?
A: The replacement timing is determined primarily through two indicators: ① The gold-plated layer of the probe shows obvious wear, exposing the base metal; ② The probe contact resistance exceeds 50% of the initial value, resulting in electrical performance degradation that causes poor test contact. Under normal working conditions, wear inspection must be carried out after the probe accumulates 300,000 touches.Q: How to select coating types (nickel plating, gold plating, hard gold)?
A: Select nickel plating (corrosion resistance) for general testing; select hard gold (wear resistance) for high frequency / high mating scenarios; semiconductor wafer testing must use a gold layer with a thickness of ≥1.27μm to avoid false labeling. Supplementary reminder: Ordinary nickel-plated probes are not recommended for low-temperature (≤-40℃) test scenarios, as the coating is prone to embrittlement and peeling.Q: What current can the probe withstand?
A: More than 30% margin must be reserved for the rated current; for high current testing (>5A), probes with heat dissipation structures must be selected to avoid sharp resistance rise.Q: What size pad can a 1μm tip test?
A: The 1μm tip is suitable for advanced packaging chips with <50μm pitch; it needs to be used with a high-precision probe station to avoid damage caused by lateral force.Q: How to install the probe properly?
A: The drilling accuracy of the jig board must reach ±0.02mm; the probe must be installed vertically; use a special flat-nose pliers, hand pressing is prohibited. After installation, it is recommended to use a dial indicator to verify the verticality of the probe, and the lateral deviation shall not be greater than 0.01mm to avoid crushing the tested device pad.Q: How to maintain dirty probes?
A: Clean the tip with an anti-static brush; alcohol and water washing are prohibited; avoid flux residue; the ambient humidity should be <30% RH. Tip: If the tip has cured flux residue, do not scrape hard, use a special dust-free swab to wipe gently to prevent tip deformation.Q: Can a blackened probe still be used? Can it be wiped with alcohol?
A: Alcohol is strictly prohibited! The oxide layer must be treated with an ultrasonic cleaner and deionized water (<40℃), or sent back to the factory for plasma cleaning; self-wiping can only restore performance temporarily, and cannot restore the integrity of the coating.Q: How to store the probes after delivery?
A: Storage environment: <30% RH, 20-25℃; use nitrogen-sealed boxes; stacking is prohibited; use shockproof foam and anti-static bags for transportation to avoid tip bending.Q: Is it necessary to ground the probe when testing CMOS chips?
A: It is mandatory to ground! The ESD protection level must reach HBM 2kV or higher; the probe holder shall be connected to the test station ground, and insulating jig boards are prohibited.Q: What are the requirements for RF probe selection in different frequency bands?
A: For conventional testing below 10GHz, general spring probes can be used; for high-frequency scenarios of 50GHz and above, GSG-structure coaxial RF probes are required, and calibration kits matching the corresponding frequency must be used to ensure signal integrity.Q: How to deal with bent probe tips?
A: Precision probes with bent tips are not recommended for on-site correction, please contact the manufacturer for return calibration or direct replacement. Forced correction will cause the probe's spring performance to fail, leading to a sharp decline in test consistency.Q: What causes the probe to overheat during use?
A: In most cases, it is caused by the actual test current exceeding the probe's rated load, or abnormal rise of the probe contact resistance. Stop operation immediately for troubleshooting to avoid probe burnout or even damage to the DUT (Device Under Test).
