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Q: What is the difference between this equipment and other die bonders of the same brand, and what is its core positioning?
A: The evo series is positioned as a highly flexible multi-module interconnect die bonding platform. It is specially designed for complex multi-chip die bonding scenarios. It can cover multiple processes including die attach and flip chip bonding in a single equipment, making it a highly compatible choice for heterogeneous integration and multi-chip module manufacturing.
Q: Can this equipment be compatible with the material carriers currently used in our production line?
A: This series natively supports material picking from wafers, waffle packs, gel packs and feeders. It can mount dies onto various carriers such as substrates, trays, PCBs, lead frames and full-format wafers. It also supports 12-inch wafer processing, which can be quickly connected to the production line without large-scale modification of the existing material handling system.
Q: Our production line covers multiple types of products, can this equipment adapt to different process requirements?
A: The equipment supports all types of dispensing processes, including dot dispensing, line dispensing, flux dispensing and dipping. It is also compatible with both cold and hot operation scenarios, covering multiple processes such as epoxy bonding, solder bonding and thermocompression bonding. A single equipment can complete the production of complex products including MCM, SiP and hybrid integration, eliminating the need to purchase multiple die bonders with different functions separately.
Q: What are the accuracy performances of different versions, and can they meet our high-end packaging requirements?
A: The standard evo model delivers XY accuracy of ±10um @3Sigma, while the evo Advanced model achieves a maximum XY accuracy of ±3um @3Sigma, with a maximum angular accuracy of ±0.07°. This fully meets the high-precision die bonding requirements of industries including memory, industrial lasers, optical communications, LiDAR, CIS, MEMS and IGBT.
Q: What is the mass production throughput performance of this equipment, will it become the bottleneck of the production line takt time?
A: The standard evo model reaches an IPT throughput of 600, with a maximum throughput of 2000 under the Uplook mode. The evo Advanced model delivers an IPT throughput of 400, which balances mass production efficiency on the premise of ensuring high precision, and adapts to the takt time requirements of most mid-to-high end packaging production lines.
Q: Is the long-term continuous production accuracy stability guaranteed?
A: After extensive long-term production line verification, the equipment is equipped with thermal compensation algorithm and high-precision motion control module, which can guarantee the accuracy consistency during long-term operation, and significantly reduce the yield loss caused by accuracy drift.
Q: Can the height sensing module of this equipment be flexibly selected for configuration?
A: The full series is standardly equipped with a contact probe height sensing module, and also supports optional non-contact laser height sensing module. Users can flexibly adjust the configuration according to the height sensing accuracy requirements of different products, to adapt to the height detection requirements of chips with different thicknesses and different materials.
Q: We have special customized production requirements, can this equipment be modified for adaptation?
A: The equipment adopts an open platform architecture, which supports 100% customization of the production process according to the personalized requirements of the production line. It can also be equipped with up to 4 working heads, paired with automatic tool changers and process-specific tooling fixtures, to fully adapt to the current and future special process and new product production requirements.
Q: For the production of complex multi-chip products, can this equipment realize a single channel to complete the entire process?
A: It supports a single channel to complete the full-process production of complex multi-chip products. All operations including picking, dispensing and mounting of different types of dies can be completed in the same equipment, eliminating the need for material transfer between multiple equipment, which greatly reduces the errors and material loss in intermediate links.
Q: Is there complete after-sales and maintenance support in China?
A: We can provide rapid-response maintenance, spare parts support and process debugging services to ensure the stable operation of the production line.
Q: Is the long-term operating cost of this equipment high?
A: This series platform is optimized in design. While ensuring high performance, it reduces the total cost of ownership. The modular structure design also lowers the cost of daily maintenance and spare parts replacement, delivering excellent ROI performance in long-term mass production.
