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Q: What application scenarios is this equipment mainly designed for? What are its differences from common traditional sorters?
A: This is an integrated Blue Film to Blue Film equipment dedicated for post-wafer dicing sorting and inspection processes. It is oriented at mid-to-large size die sorting scenarios. Different from traditional equipment that only performs simple sorting functions, this system can complete full-dimensional AOI visual inspection on the front side, back side and four side edges of dies synchronously during the sorting operation. It integrates both inspection and sorting functions in one single platform, eliminating the need for additional independent inspection stations and drastically shortening the production line material flow cycle.
Q: What size range of dies can this equipment process? Is it compatible with the existing wafer rings in our production line?
A: This equipment supports die processing with side length ranging from 0.5mm×0.5mm to 15.5mm×15.5mm. It is natively compatible with industry-standard 8-inch and 12-inch Disco metal rings, so it can directly connect to the material handling systems of most mainstream production lines without extra fixture modification.
Q: Can the cleanliness level of this equipment meet the production requirements of our advanced process chips?
A: The full machine achieves a Class 100 cleanliness level, which fully satisfies the production environment requirements for high-precision semiconductor processes. It can avoid micro-contamination that causes chip yield loss, covering the production demands of products with strict cleanliness requirements such as power devices and optical communication chips.
Q: What is the sorting throughput of this equipment? Will it become a bottleneck that slows down the takt time of our entire production line?
A: For regular 3mm×3mm products, the fastest continuous pick-and-place Cycle Time (CT) of this equipment can reach 200ms. It balances high sorting yield and high pick-and-place speed at the same time, which can perfectly match the mass production takt time of mainstream packaging and testing lines without becoming a production efficiency bottleneck.
Q: Can the placement accuracy of this equipment meet our high-precision layout requirements?
A: The X and Y directional placement accuracy of the equipment can reach ±25μm, with angular deviation controlled within ±1°. The excellent high die bonding accuracy performance fully meets the precise layout demands of most mid-to-large size dies, preventing alignment deviation issues in subsequent processes.
Q: What types of appearance defects can this equipment detect? Will there be high missed detection and false detection rates?
A: Equipped with a 6-side full-dimensional AOI inspection module, the system can automatically identify all common die appearance defects including cracks, scratches, chipping, dicing residue, dimension deviation and feature offset. Supported by mature optimized AOI algorithms, it guarantees top-tier inspection accuracy and drastically reduces the probability of missed and false detections.
Q: Our production line has custom Bin classification requirements, can this equipment adapt to our rules?
A: The equipment natively supports multi-Bin operation functions including barcode comparison, MAP row/column quantity control and pick-and-place traceability. It can perfectly match the custom classification rules of the production line and realize full-process data traceability.
Q: Without pre-importing the Wafer Map file, can the equipment still operate normally?
A: The equipment comes with native no-MAP sorting capability. It can complete autonomous positioning operation through die pattern recognition and dicing street mark recognition and correction functions, so it can stably carry out sorting and inspection without pre-loading a preset Wafer Map.
Q: Can the layout data of this equipment be exported to connect with other systems in our production line?
A: The system supports import of custom placement pattern Maps. It can automatically generate TXT-format operation files, which is convenient for docking with the production line MES system and subsequent process equipment, realizing full-link data interconnection.
Q: Do you have relevant technical accumulation and service guarantee in the semiconductor sorting equipment field?
A: We can provide full-lifecycle technical support and localized after-sales rapid response for the equipment to ensure the stable operation of your production line.
Q: What is the commissioning cycle after equipment delivery? Can it quickly integrate into our existing production line?
A: As a mature mass-produced model, this equipment has high standardization. On-site engineers can quickly complete fixture adaptation, parameter debugging and production line docking. Relying on the equipment's natively compatible universal material specifications, the line validation and onboarding cycle can be drastically shortened.
